We've seen some images of the interior of Apple's iPad 3 casing design, and now what appear to be photos of the exterior are making the rounds, courtesy of M.I.C. Gadget. The design doesn't stray too far from iPad 2 territory, but it is noticeably thicker (presumably to accommodate LTE), with a more tapered shape. Although the angle presented in these images makes the difference in thickness seem quite stark, most rumors we've seen suggest the change will only be a matter of a millimeter or two.
Additionally, MacRumors found a posting at WeiPhone purporting to show the logic board for the iPad 3. The most interesting part is the large "A5X" label on the main chip. While some were expecting the new SoC to be named the A6, A5X would fit...
from The Verge - All Posts http://www.theverge.com/
